Electrical Package Engineering Manager

Micron Semiconductor India Pvt Ltd

Hyderabad

Not disclosed

Work from Office

Full Time

Min. 10 years

Job Details

Job Description

Sr Mgr - ASIC/PMIC TPM

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

JR55609 Sr Mgr - ASIC/PMIC TPM

Senior Manager - ASIC/PMIC Package Technical Program Manager 

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 

 

In this role you will be responsible for ASIC/PMIC package design, assembly build execution, and successful qualification release into productionYou will develop packaging roadmaps and technical specifications, and collaborate with cross-functional internal engineering teams, commercial, supply chain, external OSATs, and external suppliersAs TPM you will also represent Package Development Engineering in Product Development Team (PDT) meetings and Business Unit meetings.   

 

Responsibilities 

  • Package technical requirements & specifications for package design, package assembly, and PCB assembly integration for Module/SSD products. Review, align, and enforce with internal teams and suppliers of procured components 

  • Responsible for package risk assessments, package design schedule, assembly schedule, package cost, and successfully passing package and PCBA qualifications 

  • Represent Package Development Engineering (PDE) at Product Development Team meetings, providing package updates and decisions as necessary 

  • Attend PLM milestone and stage gate review meetings to represent PDE for review and approval of projects as needed 

  • Maintain internal and external ASIC/PMIC packaging roadmaps 

  • Managing package roadmap reviews, summarizing competitive analysis reviews, and summarizing OSAT packaging capabilities & rules 

  • Support architecture pathfinding activities with package design solution proposals, risk assessments, and coordinate budgetary package costing of pathfinding projects 

  • Resolve quality issues related to packaging responsibilities for life of products 

 

Requirements 

  • The applicant should have a BS degree or higher in EE, ME, MatE, ChemE, etc.  

  • 15+ years of relevant experience 

  • Good communication and presentation skills 

  • Able to work in a global environment across multiple time zones and countries 

  • PCB assembly and packaging assembly experience is preferred 

  • Package Design or Hardware Design engineering experience is desirable 

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact hrsupport_in@micron.com

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

Job role

Work location

Hyderabad, Telangana, India

Department

Engineering - Hardware & Networks

Role / Category

Telecom

Employment type

Full Time

Shift

Day Shift

Job requirements

Experience

Min. 10 years

About company

Name

Micron Semiconductor India Pvt Ltd

Job posted by Micron Semiconductor India Pvt Ltd

This job has expired