Mechanical Simulation Engineer – Advanced Packaging

As a Mechanical Simulation Engineer, you will drive thermo-mechanical and multiphysics modeling for advanced semiconductor packaging technologies including HBM, 2.5D, and 3D integration. The role focuses on enabling robust package design through advanced simulation, material characterization, and failure mechanism understanding. You will actively integrate Generative AI, AI Assistant tools, and broader Artificial Intelligence capabilities to optimize modeling workflows, enhance predictive analytics, and automate complex simulations. This includes leveraging AI to improve simulation accuracy, reduce cycle time, and enable advanced modeling capabilities. You will collaborate with cross-functional teams across package architecture, fabrication, and assembly process integration to develop predictive simulation methodologies and influence design decisions. 

Job Responsibilities: 

• Perform linear and non-linear static analysis for package and material behavior 

• Conduct fatigue, fracture mechanics, and reliability simulations for advanced packages 

• Develop multiphysics models (thermo-mechanical, thermal, structural, fluidic) 

• Model interfaces including contact, shear, delamination, and interfacial damage 

• Integrate Generative AI, AI Assistant tools, and Artificial Intelligence for simulation acceleration and optimization 

• Apply AI/ML techniques for surrogate modeling, reduced-order modeling, and design optimization 

• Develop and deploy automation workflows for simulation setup, solve, and post-processing 

• Leverage data-driven methods to enhance model fidelity and reduce turnaround time 

• Support development of HBM, 2.5D/3D packages, TSV, and hybrid bonding technologies 

• Understand fabrication and assembly processes such as thermo-compression bonding, reflow, and wafer bonding 

• Develop material models for polymers, composites, and thin-film stacks 

• Drive material characterization workflows and validation 

• Perform failure and reliability analysis including fatigue life and crack propagation 

• Collaborate with global cross-functional teams 

Experience: 

2-5 years of experience in Mechanical/Materials engineering within semiconductor or advanced packaging domains, with experience in AI-driven modeling, automation, or data-driven simulation techniques preferred.