AI / Simulation Engineer (Thermal - Electronics Cooling)

• Develop and execute Computational Fluid Dynamic (CFD) and thermal simulations for electronics cooling applications, including airflow, forced and natural convection, and conjugate heat transfer
• Support component-, board-, enclosure-, cabinet-, and sub-system–level thermal analysis for products such as circuit breakers, PLCs, laptops, and appliances
• Analyze industrial environments (EIA) including high ambient temperatures, enclosure heating, dust effects, and derating requirements
• Assist in rapid model setup and simulation turnaround to support internal service requests and customer engineering needs
• Apply appropriate boundary conditions including power losses (I²R, switching losses), contact resistance, and environmental loads
• Support steady-state and transient thermal analyses, including power cycling, duty cycles, startup conditions, and basic fault scenarios
• Evaluate airflow distribution in control panels, switchgear assemblies, and electronic enclosures
• Post-process and interpret simulation results to identify thermal risks, hotspots, airflow inefficiencies, and design improvement opportunities
• Assist in correlating simulation results with temperature rise tests, lab measurements, and field observations
• Prepare clear technical summaries and documentation of assumptions, methods, results, and limitations
• Support verification and validation (V&V) activities, including comparison with test data using engineering metrics
• Engage with senior engineers to understand UL/IEC standards, certification requirements, and temperature rise limits
• Learn and apply best practices in mesh strategy, numerical stability, convergence assessment, and result credibility
• Support design optimization activities such as heat sink sizing, airflow path improvement, and enclosure ventilation strategies
• Collaborate effectively with cross-functional teams (electrical, mechanical, regulatory) and contribute to a learning-oriented, supportive team culture